scia Systems is a German full range supplier of advanced ion beam and plasma processing equipment. The systems are applicable for coating and etching processes in the production of microelectronics, MEMS and precision optical components, in both, high volume production as well as research and development environments.
Due to their flexible and modular design, the systems can be configured according to customer specific requirements. Amongst others by combining several vacuum process chambers into cluster or in-line solutions. Together with our worldwide service partners, we offer comprehensive service and superior technology support.
Advanced Optical Processing Equipment
The ion beam and plasma processing equipment of scia Systems is applicable for various coating and etching processes in precision optics manufacturing. We equip the optics industry with ultra-precise process equipment.
Particularly noteworthy are systems for the multilayer coating of x-ray optics, optics in the visible range and optics for extreme ultraviolet lithography (EUVL).
Dual ion beam sputter deposition system for homogeneous coatings of high precision optics. The scia Coat 200 uses one ion beam source for sputtering and a second, for pre-cleaning the substrate and assist during deposition. The system is also equipped with a rotational target holder for up to 6 different target materials. Typical applications are multilayer films for X-ray mirrors, high- and anti-reflective coatings with high laser damage threshold, optical filters and ion beam smoothing.
The scia Cube 750 is used for high density plasma processes and enables Reactive Ion Etching as well as Plasma Enhanced Chemical Vapor Deposition. The system combine plasma excitation by an array of microwave sources and independently a RF bias for the substrate stage. Typical applications are etching processes with oxygen or halogen chemistry for the structuring of computer generated holograms (CGHs) as well as the deposition of dielectric films for optical filters and anti-reflective coatings.
The scia Mill 150 is used for full substrate Ion Beam Etching/Milling with superior homogeneity. The system can also be applied for Reactive Ion Beam Etching as well as for Chemically Assisted Ion Beam Etching. The tilt- and rotatable substrate stage enables to adjust the arbitrary substrate orientation. Typical applications of the system are structuring of multilayer stacks for sensors, production of 3-dimensional opto-electric microstructures and ion beam smoothing.
Technical Sales Manager
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